With 16 years of expertise in optical communications, FIC Global is powering the next wave of advancement for AI with leading-edge optical transceivers up to 1.6T and beyond.
TAIPEI, July 15, 2025 /PRNewswire/ -- As artificial intelligence continues to reshape the global economy, fiber optic connections have emerged as a key enabler of the scale and speed AI factories require. A little-known but critical component — optical transceivers — is at the core, and FIC Global Inc. (TWSE: 3701; FICG), a leading expert in packaging and installing semiconductors on optical modules, is drawing on over 16 years of expertise to take the lead in this space.
FIC Global is powering the next wave of advancement for AI with leading-edge optical transceivers up to 1.6T and beyond.
"The full potential of AI will only be unleashed when data can move at light speed among AI cluster networks," remarked Mr. Leo Chien, Chairman of FICG. "That's why we've spent over a decade building the process leadership and technologies to make the most advanced optical transceivers for AI factories."
Enabling breakthrough capabilities for AI factories
The AI factories of the future require high speed and low latency at scale, along with greater energy efficiency to temper significant power demands. But electrical connections are limited in terms of performance and data transmission. Using fiber optics to interconnect AI clusters offers:
- Unmatched bandwidth and low latency
- Energy efficiency
- Infrastructure scalability
As the key component, optical transceivers convert electrical signals into light data for transmission over fiber optic cables, significantly accelerating data movement between compute nodes. This year, the new benchmark for data transmission speeds is now 1.6 terabits (T) per second, and companies like FICG are innovating to double speeds in the future.
FICG: A decade of engineering in optical communications
FICG brings more than 16 years of expertise in process leadership and manufacturing technology, delivering optical transceivers for telecommunications, enterprise networks, data centers, and cloud computing since 2008. The company's early leadership in optical communications give it a major advantage to harness the current AI boom.
From 2008 to 2020, when it included chips-on-board, FICG made significant technological advancements:
- 2008: Established the foundation for optical module manufacturing with 1.25G small form factor and 2G copper modules
- 2010: Enhanced capabilities by launching 2G and 4G small form-factor pluggable modules
- 2012: Further expanded by introducing 8G, 10G, and 40G modules
- 2014: Launched the first 100G modules and entered the high-speed module segment with 100G C-Wire, 100G C form-factor pluggable, and 100G Topaz modules
- 2016: Introduced 400G applications and achieved commercialization of the latest 100G modules
- 2018: Further advanced 400G, 200G, and 100G solutions to support diverse high-speed switching and optical transport architectures
These achievements come from FICG's competitive vertically integrated model and process leadership. It focuses on joint design manufacturing (JDM) and high-performance, high-precision printed circuit board assembly (PCBA), and then packages PCBs with semiconductors. Specifically, FICG integrates higher-tech manufacturing processes like 2.5D and 3D semiconductor packaging and bare-die flip chip installation with the more mainstream surface mount technology for the rest of a PCB, enabling customers to consolidate their optical module supply chains.
The company also mastered ultra-miniaturization manufacturing techniques early on, including the installation of component sizes such as 008004 (0.25x0.125 mm), 01005 (0.4x0.2 mm), and 0201 (0.6x0.3 mm) — almost as small as a hair's breadth.
Today, FICG supplies major players worldwide and collaborates closely with semiconductor manufacturers. It represents 20% of global market share in 400G, 18% in 800G, and is establishing a lead in the latest 1.6T segment while innovating for 3.2T.
About FIC Global Inc.
FIC Global Inc. (TWSE: 3701) is a leading provider of optical transceivers, specializing in the semiconductor packaging and advanced printed circuit board (PCB) assembly. Formed by the integration of FIC, Ubiqconn and 3cems, FICG leverages a strong foundation of expertise to deliver innovative solutions. With expertise in optical modules since 2008, FICG has rapidly grown into a key player in the global supply chain, collaborating with major industry leaders worldwide and standing out for cutting-edge, high-yield manufacturing capabilities.
